Laser Cutting Machine Series MS0305-V-A
Laser power（w）
Han's Yueming Laser Group's laser splitter adopts multi-processing platforms, and one machine is multi-purpose, which can meet the cutting and processing needs of PCB soft, hard board, cover film, etc. It adopts imported UV cavity frequency doubling technology laser, which has little thermal impact and good effect. ; Independent research and development of professional laser cutting board software system to achieve automatic positioning and cutting processing and stable machine work; classic applications - PCB laser cutting, soft board laser cutting, etc.
- Advantages
- Video
- Parameter
- Application
Advantages
Integrate multi-function into one , create more value for customer
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01
Multiple working platforms with multiple functions to meet the processing requirement for soft&hard PCB board as well as the cover film.
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02
Imported UV laser generator with intra-cavity frequency doubling technique: small light spot, exquisite marking , small heat effect, good cutting result.
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03
Imported digital high-speed mirror: small size, high speed, good stability.
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04
High-performance CCD visual system enables auto-positioning cutting.
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05
Self-developed processional cutting software system, easy to learn & operate.
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06
Imported UV laser generator & optical system, ensuring sable working under long-time working condition. Full optical pathway protection ensures safer operation.MTassembly line.
Parameters
Optimization and innovation, make product faster, more stable and more assured.
| Model | MS0305-V-A double station | MS0605-V-A |
|---|---|---|
| Laser power(W) | 10-18-30 | 15 -30 |
| Working area(mm) | 250*500 | 650*550 |
| Overall dimension（mm） | 1400*1450*2000 | 1400*1550*2050 |
| Accuracy(um) | ±30um | ±30um |
| X/Y working platform | Linear motor | Linear motor |
| Weight(kg) | 1800 | 1800 |
| Working environment | Temp: 15~35°C Humidity: 5~85% Clean,less dust | 温度: 15~30 ℃ , 相对湿度 : 5 ~85 %, 无凝水,无灰尘或灰尘较少 |
| Spot size （mm） | <20 | <20 |
| Total power(Kw) | 5.5 | 5.5 |
Application
It can be applied to the fine cutting and sub-board processing of hard boards, soft boards, cover films and other products.
